Umngxuma oRound IC socket Connector DIP 6 8 14 16 18 20 24 28 40 pin Iisokethi DIP6 DIP8 DIP14 DIP16 DIP18 DIP20 DIP28 DIP40 izikhonkwane
Umbane
Ukusebenza kombane
Ukuchasa uQhagamshelwano: 30mΩmax.DC100mA
Ukuchasana noqhagamshelwano: 30mΩ max.DC100mA
Ukumelana ne-Insulator: 1000MΩmin.atDC500v
Ukumelana ne-Insulation: 1000MΩmin.atDC500v
Ukumelana nombane: AC500V/1Min
Ukumelana nombane: AC500V/1Min
Umgangatho wangoku: 1AMP
Ikalwelwe ngoku: 1AMP
Izinto eziphathekayo
Izinto eziphathekayo kunye neeplating
Izindlu: PBT&20% IFayibha yeglasi
Amalungu ePlastiki: PBT&20% IFayibha yeglasi
Uqhagamshelwano: Ubhedu lwefosphor
Izinto zoqhagamshelwano: i-phosphor bronze
Iisokethi ze-IC kwizicelo
Kwincwadi yamanqaku kunye neekhompyuter zedesktop, iisokethi zethu ze-LGA zifaka ipleyiti yebholster eyomeleleyo yoqhagamshelo oluthembekileyo kwiphakheji ye-microprocessor ngelixa unciphisa ukugoba kwe-PCB ngexesha loxinzelelo.Kwiiseva, iisokethi zethu ze-mPGA kunye ne-PGA -- kunye noluhlu oluqhelekileyo olufumaneka kwizikhundla ezingaphezu kwe-1,000 -- zibonelela ngokufaka i-zero ujongano lwamandla kwi-microprocessor PGA ipakethe kwaye uncamathele kwi-PCB ene-solder-Mount technology soldering.Iisokethi ze-TE's IC ziyilelwe ukusebenza okuphezulu kweeprosesa ze-CPU.
Iziseko zeSekethe eziDityanisiweyo
Kwincwadi yamanqaku kunye neekhompyuter zedesktop, iisokethi zethu ze-LGA zifaka ipleyiti yebholster eyomeleleyo yoqhagamshelo oluthembekileyo kwiphakheji ye-microprocessor ngelixa unciphisa ukugoba kwe-PCB ngexesha loxinzelelo.Kwiiseva, iisokethi zethu ze-MPGA kunye ne-PGA -- kunye noluhlu oluqhelekileyo olufumaneka kwiindawo ezingaphezu kwe-1,000 --unikezelo lwamandla okufaka i-ziro (ZIF) ujongano kwi-microprocessor PGA package kwaye uncamathele kwi-PCB nge-solder-mount technology (SMT) soldering.Iisokethi ze-TE's IC ziyilelwe ukusebenza okuphezulu kweeprosesa ze-CPU.
| Inombolo yendawo | Isidibanisi seSokethi se-IC | I-pitch | 2.54mm |
| Qhagamshelana noKuchasa | 20mΩ ubuninzi | I-Voltage | AC 500V/Umzuzu |
| Isigquduli | Thermoplastic UL94V-0 | Izixhobo zoQhagamshelwano | Ingxubevange yobhedu |
| Uluhlu lobushushu | -40 ° ~ +105 ° | Izikhundla | 6-42 |
| Umbala | Mnyama/OEM | Uhlobo lokuNyusa | DIP |
| Ixesha lexabiso | EXW | MOQ | Amaqhekeza angama-50 |
| Ixesha lokukhokhela | Iintsuku ze-7-10 zeShishini | Ixesha lokuhlawula | T/T,Paypal,Western Union |
Ezi ziqhagamshelo ziyilelwe ukubonelela ngonxibelelwano olucinezelayo phakathi kweenkokeli zecandelo kunye nebhodi yesekethe eprintiweyo (PCB).Iisokethi zethu zesekethe ezidibeneyo (IC) zenzelwe ukubonelela nge-compressive interconnect phakathi kwecandelo elikhokelayo kunye nePCB.Iisokethi zethu ze-IC zenzelwe ukunceda ukwenza lula uyilo lwebhodi, ukwenza uhlengahlengiso olulula kunye nokwandisa kunye nokulungiswa lula kunye nokutshintshwa.Uyilo lunikeza isisombululo esineendleko ngaphandle komngcipheko wokubethelwa ngokuthe ngqo.
